Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu
Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries, making it a critical material for the production of micro-machinery and micro-components; however, achieving ultrahigh precision and ultralow damage machining of functional dev...
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| Автори: | , , , , , , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
AIP Publishing LLC
2025-03-01
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| Серія: | Nanotechnology and Precision Engineering |
| Онлайн доступ: | http://dx.doi.org/10.1063/10.0028756 |
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