Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu
Monocrystalline Cu exhibits excellent electrical and signal-transmission properties due to its absence of grain boundaries, making it a critical material for the production of micro-machinery and micro-components; however, achieving ultrahigh precision and ultralow damage machining of functional dev...
保存先:
| 主要な著者: | , , , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
AIP Publishing LLC
2025-03-01
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| シリーズ: | Nanotechnology and Precision Engineering |
| オンライン･アクセス: | http://dx.doi.org/10.1063/10.0028756 |
| タグ: |
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