Reliability Analysis of Power IGBT Modules
Firstly, the module concept, packaging procedures, reliability and failure rules was presented. Then, the standard tests methodologies for investigating module reliability including endurance and environment tests were discussed. Lastly, the main failure mechanisms such as wire bonds failure, chip m...
محفوظ في:
| المؤلفون الرئيسيون: | , , |
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| التنسيق: | Artigo |
| اللغة: | Chinês |
| منشور في: |
Editorial Department of Electric Drive for Locomotives
2013-01-01
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| سلاسل: | 机车电传动 |
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2013.01.005 |
| الوسوم: |
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