High-Sensitivity Defect Inspection for Unpatterned Wafers via Integrating Dark-Field Scattering and Diffraction Phase Microscopy
To overcome the limitations in the sensitivity and reliability of conventional wafer defect inspection techniques, a novel dual-channel optical inspection system is proposed by combining dark-field scattering with diffraction phase microscopy. Such an integrated system simultaneously acquires dark-f...
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| Autors principals: | , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2026-02-01
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| Col·lecció: | Sensors |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/1424-8220/26/4/1271 |
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