Materials Design Principles for Large Memory Windows: Coercive Voltage Engineering in Ferroelectric– Dielectric Heterostructures
ABSTRACT The integration of dielectric inserts into hafnia‐based ferroelectric stacks has emerged as a promising route to expand memory windows in ferroelectric NAND. However, the physical origin of the associated coercive voltage enhancement has remained unclear. Here, we resolve this long‐standing...
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| 主要な著者: | , , , , , , , , , , , , , , , , , , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Wiley-VCH
2026-04-01
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| シリーズ: | Advanced Electronic Materials |
| 主題: | |
| オンライン・アクセス: | https://doi.org/10.1002/aelm.202500702 |
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