Materials Design Principles for Large Memory Windows: Coercive Voltage Engineering in Ferroelectric– Dielectric Heterostructures
ABSTRACT The integration of dielectric inserts into hafnia‐based ferroelectric stacks has emerged as a promising route to expand memory windows in ferroelectric NAND. However, the physical origin of the associated coercive voltage enhancement has remained unclear. Here, we resolve this long‐standing...
Gorde:
| Egile Nagusiak: | , , , , , , , , , , , , , , , , , , , , , |
|---|---|
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
Wiley-VCH
2026-04-01
|
| Saila: | Advanced Electronic Materials |
| Gaiak: | |
| Sarrera elektronikoa: | https://doi.org/10.1002/aelm.202500702 |
| Etiketak: |
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
|
