Mixed-Defect Wafer Map Classification Using CapsNet-Based Models With Precise Scratch-Pattern Reconstruction
Wafer maps of large-scale integration chips are matrices showing the defective chip position on a wafer. Determining defect patterns on wafer maps is crucial because these patterns indicate the root cause of defects in the manufacturing process. Convolutional neural networks can successfully extract...
שמור ב:
| Principais autores: | , , , , |
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| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
IEEE
2025-01-01
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| סדרה: | IEEE Access |
| נושאים: | |
| גישה מקוונת: | https://ieeexplore.ieee.org/document/11202899/ |
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