The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits

The use of vertically stacked architectures in three-dimensional integrated circuits (3DICs) offers a transformative path for advancing Moore’s Law by significantly boosting computational density. A key obstacle arises from the integration of heterogeneous materials, which introduces critical thermo...

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Auteurs principaux:	Yi-Cheng Chan, Ming-Han Liao, Chun-Wei Yao
Format:	Artigo
Langue:	Inglês
Publié:	MDPI AG 2025-09-01
Collection:	Applied Sciences
Sujets:	through silicon via (TSV) three-dimensional integrated circuit (3DIC) thermal expansion
Accès en ligne:	https://www.mdpi.com/2076-3417/15/17/9847
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