The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits
The use of vertically stacked architectures in three-dimensional integrated circuits (3DICs) offers a transformative path for advancing Moore’s Law by significantly boosting computational density. A key obstacle arises from the integration of heterogeneous materials, which introduces critical thermo...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2025-09-01
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| coleção: | Applied Sciences |
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| Acesso em linha: | https://www.mdpi.com/2076-3417/15/17/9847 |
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