The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air
Low-temperature Cu-Cu bonding technology plays a key role in high-density and high-performance 3D interconnects. Despite the advantages of good electrical and thermal conductivity and the potential for fine pitch patterns, Cu bonding is vulnerable to oxidation and the high temperature of the bonding...
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| Egile Nagusiak: | , , |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
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MDPI AG
2021-10-01
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| Saila: | Applied Sciences |
| Gaiak: | |
| Sarrera elektronikoa: | https://www.mdpi.com/2076-3417/11/20/9444 |
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