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Silicon Micromachining for High Performance Passive Structures at W Band

This paper presents a micromachined technology allowing the realization of very high aspect ratio millimeter-wave circuits. Appropriate 3D electromagnetic simulations based on the finite element method have been implemented to design the circuits. Coplanar transmission lines featuring loss level in...

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主要な著者: B. Guillon, K. Grenier, T. Parra, P. Pons, D. Cros, P. Blondy, J. Graffeuil, J. L. Cazaux, R. Plana
フォーマット: Artigo
言語:Inglês
出版事項: Wiley 2002-01-01
シリーズ:Active and Passive Electronic Components
オンライン・アクセス:http://dx.doi.org/10.1080/08827510211278
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