A Thermal Actuated Bistable Structure for Generating On-Chip Shock Loads
In this paper, we propose a bistable shock structure based on the thermal actuation principle, which overcomes the response time limitation of heating and cooling in typical thermal actuators and enables a rapid release of energy. Thus, force with a steep rising edge can be applied on a target. Usin...
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| Autors principals: | , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2022-04-01
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| Col·lecció: | Micromachines |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2072-666X/13/4/569 |
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