Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal
During the diamond wire saw cutting process of sapphire crystals, warpage is one of the key parameters for evaluating wafer quality. Based on the thermoelasticity theory and diamond wire saw cutting theory, a finite element model for thermal analysis of diamond wire saw cutting sapphire crystals was...
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| Egile Nagusiak: | , , , |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
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MDPI AG
2024-08-01
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| Saila: | Applied Sciences |
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| Sarrera elektronikoa: | https://www.mdpi.com/2076-3417/14/17/7667 |
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