Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon
Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. T...
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| Autores principales: | , , , , , |
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| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
MDPI AG
2023-07-01
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| Colección: | Micromachines |
| Materias: | |
| Acceso en línea: | https://www.mdpi.com/2072-666X/14/8/1512 |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
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