Microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints during thermomigration
Abstract The Ni–P stratum was fabricated upon the Cu substrate via an electroless plating technique, and the microstructure and properties of electroless Ni–P/Sn2.5Ag0.7Cu0.1RE micro-joints under temperature gradient was studied. Research indicates that in the initial stage of thermomigration in mic...
I tiakina i:
| Ngā kaituhi matua: | , , , , , |
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| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
Nature Portfolio
2025-03-01
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| Rangatū: | Scientific Reports |
| Ngā marau: | |
| Urunga tuihono: | https://doi.org/10.1038/s41598-025-89492-1 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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