Effect of Abrasive Grain Concession on Micromechanical Behavior of Lapping Sapphire by FAP

Aiming at exploring the material removal mechanism for sapphire using diamond abrasive grains at the microscopic level, this paper modeled and analyzed the microscopic yield behavior of diamond abrasive grains in the FAP grinding process of sapphire. Molecular dynamics were used to simulate the effe...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Huimin Xu, Jianbin Wang, Yiliang Xu, Qingan Li, Benchi Jiang
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	MDPI AG 2022-08-01
Sarja:	Micromachines
Aiheet:	sapphire molecular dynamics lapping cutting depth removal mechanism
Linkit:	https://www.mdpi.com/2072-666X/13/8/1322
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