Analysis of a novel packaging technique for natural voltage balancing of series-connected SiC-MOSFETs
This paper analyzes a novel packaging technique to improve the voltage-sharing performances of series-connected SiC-MOSFETs. The proposed method takes advantage of the parasitic capacitance network introduced by the packaging dielectric isolation layers to reduce the voltage imbalance across the ser...
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| Principais autores: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Elsevier
2025-06-01
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| coleção: | Power Electronic Devices and Components |
| Assuntos: | |
| Acesso em linha: | http://www.sciencedirect.com/science/article/pii/S2772370425000227 |
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