Effect of Warm Crossing Rolling on the Microstructure, Texture and Annealing Behavior of High-Purity Tantalum

With advanced integrated circuit semiconductor chips, the uniformity of microstructure and texture is increasingly required for tantalum (Ta) targets. A combination of warm rolling and 135° cross rolling (CR) at the temperature of 500 °C and 800 °C, i.e., warm cross rolling (WCR), was carried out in...

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Principais autores:	Yuping Ding, Song Wang, Min Zhang, Shiyuan Zhou, Shifeng Liu, Xiaoli Yuan
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2023-04-01
coleção:	Metals
Assuntos:	microstructure texture warm cross rolling annealing tantalum
Acesso em linha:	https://www.mdpi.com/2075-4701/13/5/838
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