Combined Use of 3D and HSI for the Classification of Printed Circuit Board Components
Successful recycling of electronic waste requires accurate separation of materials such as plastics, PCBs and electronic components on PCBs (capacitors, transistors, etc.). This article therefore proposes a vision approach based on a combination of 3D and HSI data, relying on the mutual support of t...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2021-09-01
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| coleção: | Applied Sciences |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2076-3417/11/18/8424 |
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