Combined Use of 3D and HSI for the Classification of Printed Circuit Board Components

Successful recycling of electronic waste requires accurate separation of materials such as plastics, PCBs and electronic components on PCBs (capacitors, transistors, etc.). This article therefore proposes a vision approach based on a combination of 3D and HSI data, relying on the mutual support of t...

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Hlavní autoři:	Songuel Polat, Alain Tremeau, Frank Boochs
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	MDPI AG 2021-09-01
Edice:	Applied Sciences
Témata:	hyperspectral imaging 3D data point cloud classification rule-based classification waste sorting
On-line přístup:	https://www.mdpi.com/2076-3417/11/18/8424
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