Research Status of Microchannel Heat Dissipation Technologybased on Porous Structure
With the rapid development of microelectronic devices, electronic devices are increasingly inclined towards the direction of small, lightweight, high integration, and high heat flux density. Porous structures are widely used in the field of heat dissipation due to their ability to effectively expand...
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| Главные авторы: | , |
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| Формат: | Artigo |
| Язык: | Chinês |
| Опубликовано: |
Journal of Refrigeration Magazines Agency Co., Ltd.
2025-01-01
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| Серии: | Zhileng xuebao |
| Предметы: | |
| Online-ссылка: | http://www.zhilengxuebao.com/thesisDetails?columnId=67630479&Fpath=home&index=0 |
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