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RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances

Abstract With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the r...

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Principais autores: Tang Bo, Wang Zhengwei, Weiqiu Huang, Li Sen, Ma Tingting, Yu Haogang, Li Xufei
Format: Artigo
Sprog:Inglês
Udgivet: SpringerOpen 2017-09-01
Serier:Nanoscale Research Letters
Fag:
Thermal Interface Materials
Graphene
Thermal Boundary Resistance
Online adgang:http://link.springer.com/article/10.1186/s11671-017-2298-z
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