RGO and Three-Dimensional Graphene Networks Co-modified TIMs with High Performances
Abstract With the development of microelectronic devices, the insufficient heat dissipation ability becomes one of the major bottlenecks for further miniaturization. Although graphene-assisted epoxy resin (ER) display promising potential to enhance the thermal performances, some limitations of the r...
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| Auteurs principaux: | , , , , , , |
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| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
SpringerOpen
2017-09-01
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| Collection: | Nanoscale Research Letters |
| Sujets: | |
| Accès en ligne: | http://link.springer.com/article/10.1186/s11671-017-2298-z |
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