Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process
This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the...
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| Autors principals: | , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2021-07-01
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| Col·lecció: | Metals |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2075-4701/11/8/1155 |
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