An End-to-End Design and Simulation Methodology for Evaluating Package-Induced Signal Integrity Degradation in PCIe Channels

This paper presents an end-to-end simulation methodology for evaluating package-induced signal integrity (SI) degradation in a peripheral component interconnect express (PCIe) 5.0 channel. By integrating package, printed circuit board (PCB), and add-in card (AIC) structures into a unified simulation...

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Autores principales:	Siwook Park, Uichan Kim, Jonghyun Lee, Jiwoon Moon, Yuchul Jung, Youngwoo Kim
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	MDPI AG 2026-02-01
Colección:	Micromachines
Materias:	end-to-end package-induced degradation PCIe signal integrity (SI)
Acceso en línea:	https://www.mdpi.com/2072-666X/17/2/218
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