Effect of sputtering process parameters on the uniformity of copper film deposited in micro-via
Abstarct: With the increase of the density of interconnecting technology for chip packaging, it is required to form smaller vertical interconnect micro-via in insulating dielectric materials with advanced packaging technology. However, a continuous and uniform copper film cannot be formed on the sid...
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| Główni autorzy: | , , , , , |
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| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
Elsevier
2023-07-01
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| Seria: | Journal of Materials Research and Technology |
| Hasła przedmiotowe: | |
| Dostęp online: | http://www.sciencedirect.com/science/article/pii/S2238785423014928 |
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