Effect of sputtering process parameters on the uniformity of copper film deposited in micro-via
Abstarct: With the increase of the density of interconnecting technology for chip packaging, it is required to form smaller vertical interconnect micro-via in insulating dielectric materials with advanced packaging technology. However, a continuous and uniform copper film cannot be formed on the sid...
Uloženo v:
| Hlavní autoři: | , , , , , |
|---|---|
| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
Elsevier
2023-07-01
|
| Edice: | Journal of Materials Research and Technology |
| Témata: | |
| On-line přístup: | http://www.sciencedirect.com/science/article/pii/S2238785423014928 |
| Tagy: |
Žádné tagy, Buďte první, kdo vytvoří štítek k tomuto záznamu!
|