Investigation of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joints
The effect of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joint was studied, and the shedding mechanism of intermetallic compounds (IMCs) in the solder joint during transient liquid phase (TLP) bonding process was investigated. The results show...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
IOP Publishing
2020-01-01
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| Col·lecció: | Materials Research Express |
| Matèries: | |
| Accés en línia: | https://doi.org/10.1088/2053-1591/ab62f2 |
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