Research of Wafer Level Bonding Process Based on Cu–Sn Eutectic
In 3D-system packaging technologies, eutectic bonding is the key technology of multilayer chip stacking and vertical interconnection. Optimized from the aspects of the thickness of the electroplated metal layer, the pretreatment of the wafer surface removes the oxide layer, the mutual alignment betw...
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| Hlavní autoři: | , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI AG
2020-08-01
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| Edice: | Micromachines |
| Témata: | |
| On-line přístup: | https://www.mdpi.com/2072-666X/11/9/789 |
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