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Investigation of the profilogram structure of microstrip microwave modules manufactured using additive 3D-printing technology

Objectives. The aim of the work is to study the surface roughness of the current-carrying topology and dielectric of the upper (Top Layer) and lower (Bottom Layer) sides of microwave modules manufactured using additive three-dimensional printing technology when prototyping prototypes of microwave mo...

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Uloženo v:
Hlavní autoři: D. S. Vorunichev, M. S. Kostin
Médium: Artigo
Jazyk:Russo
Vydáno: MIREA - Russian Technological University 2023-10-01
Edice:Российский технологический журнал
Témata:
3d printing
microwave module
prototyping
additive technology
nanoink
microstrip sensors
microwave elements
multilayer printed circuit boards
radiophysical parameters
structural heterogeneity
On-line přístup:https://www.rtj-mirea.ru/jour/article/view/761
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