Noncuring Graphene Thermal Interface Materials for Advanced Electronics

Abstract Development of next‐generation thermal interface materials (TIMs) with high thermal conductivity is important for thermal management and packaging of electronic devices. The synthesis and thermal conductivity measurements of noncuring thermal paste, i.e., grease, based on mineral oil with a...

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Главные авторы:	Sahar Naghibi, Fariborz Kargar, Dylan Wright, Chun Yu Tammy Huang, Amirmahdi Mohammadzadeh, Zahra Barani, Ruben Salgado, Alexander A. Balandin
Формат:	Artigo
Язык:	Inglês
Опубликовано:	Wiley-VCH 2020-04-01
Серии:	Advanced Electronic Materials
Предметы:	graphene percolation threshold thermal conductivity thermal‐interface materials thermal paste
Online-ссылка:	https://doi.org/10.1002/aelm.201901303
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