Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable w...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Ling Yun Niu, Hao Chi Zhang, Pei Hang He, Yi Fan, Le Peng Zhang, Tie Jun Cui
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	IOP Publishing 2023-01-01
Sarja:	JPhys Photonics
Aiheet:	spoof surface plasmon polaritons (SSPPs) electromagnetic compatibility (EMC) multi-function substrate integrated packaging technology tuneable wavenumber mismatching technology
Linkit:	https://doi.org/10.1088/2515-7647/acacda
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