Electromagnetic compatibility technologies based on multi-functional spoof surface plasmon polariton channels

High integration of modern microwave circuits and systems puts forward higher requirements for multi-function and electromagnetic compatibility (EMC) performance of transmission channels. In this paper, we propose two EMC technologies including the substrate integrated packaging (SIP) and tuneable w...

Πλήρης περιγραφή

Λεπτομέρειες βιβλιογραφικής εγγραφής

Κύριοι συγγραφείς:	Ling Yun Niu, Hao Chi Zhang, Pei Hang He, Yi Fan, Le Peng Zhang, Tie Jun Cui
Μορφή:	Artigo
Γλώσσα:	Inglês
Έκδοση:	IOP Publishing 2023-01-01
Σειρά:	JPhys Photonics
Θέματα:	spoof surface plasmon polaritons (SSPPs) electromagnetic compatibility (EMC) multi-function substrate integrated packaging technology tuneable wavenumber mismatching technology
Διαθέσιμο Online:	https://doi.org/10.1088/2515-7647/acacda
Ετικέτες:	Προσθήκη ετικέτας Δεν υπάρχουν, Καταχωρήστε ετικέτα πρώτοι!