Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subj...
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| Autors principals: | , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Polish Academy of Sciences
2017-06-01
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| Col·lecció: | Archives of Metallurgy and Materials |
| Matèries: | |
| Accés en línia: | http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0182/amm-2017-0182.xml?format=INT |
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