Effect of Pd-P Layer on the Bonding Strength of Bi-Te Thermoelectric Elements
In this study, the effect of electroless Pd-P plating on the bonding strength of the Bi-Te thermoelectric elements was investigated. The bonding strength was approximately doubled by electroless Pd-P plating. Brittle Sn-Te intermetallic compounds were formed on the bonding interface of the thermoele...
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| Principais autores: | , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Polish Academy of Sciences
2019-09-01
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| Colecção: | Archives of Metallurgy and Materials |
| Assuntos: | |
| Acesso em linha: | https://journals.pan.pl/Content/113009/PDF/AMM-2019-3-28-Son.pdf |
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