Wire radiator with heat pipes for computing equipment
One approach to improving heat dissipation efficiency from computing components such as high-performance microprocessors is proposed. A prototype wire radiator was studied, consisting of copper wire with a diameter of 0.12 mm wound around a frame of two heat pipes, each 6 mm in diameter and 500 mm l...
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| Principais autores: | , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Politekhperiodika
2004-12-01
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| Colecção: | Технологія та конструювання в електронній апаратурі |
| Assuntos: | |
| Acesso em linha: | https://tkea.com.ua/index.php/journal/article/view/1103 |
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