Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines
Nanotwinned Cu (NT-Cu), with numerous advantages, is highly suitable for implementation in Cu redistribution lines (RDLs). However, oxidation is a significant reliability concern as it accelerates resistance increase and shortens the electromigration (EM) lifetime of fine-pitch NT-Cu lines. In this...
Shranjeno v:
| Principais autores: | , , , , |
|---|---|
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Elsevier
2025-05-01
|
| Serija: | Journal of Materials Research and Technology |
| Teme: | |
| Online dostop: | http://www.sciencedirect.com/science/article/pii/S2238785425009603 |
| Oznake: |
Brez oznak, prvi označite!
|