Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines
Nanotwinned Cu (NT-Cu), with numerous advantages, is highly suitable for implementation in Cu redistribution lines (RDLs). However, oxidation is a significant reliability concern as it accelerates resistance increase and shortens the electromigration (EM) lifetime of fine-pitch NT-Cu lines. In this...
I tiakina i:
| Ngā kaituhi matua: | , , , , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
Elsevier
2025-05-01
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| Rangatū: | Journal of Materials Research and Technology |
| Ngā marau: | |
| Urunga tuihono: | http://www.sciencedirect.com/science/article/pii/S2238785425009603 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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