Effect of Joule heating on the reliability of microbumps in 3D IC
Due to the demand for high-performance electronic products, there has been a rapid development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D stacking relies on microbumps and through silicon vias (TSVs) to connect multiple Si dies vertically. These high-performance ele...
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| Autori principali: | , , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Elsevier
2024-07-01
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| Serie: | Journal of Materials Research and Technology |
| Soggetti: | |
| Accesso online: | http://www.sciencedirect.com/science/article/pii/S2238785424015965 |
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