Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound
Warpage in semiconductor packages is a critical issue that affects their reliability and performance. This study aims to minimize the warpage of a bi-material dummy package by optimizing the post-mold curing (PMC) temperature profile. A warpage simulation model was developed considering the viscoela...
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| Principais autores: | , , , , |
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| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Elsevier
2024-09-01
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| Serija: | Materials & Design |
| Teme: | |
| Online dostop: | http://www.sciencedirect.com/science/article/pii/S0264127524006403 |
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