Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites

Using copper-boron alloy as the metal matrix and different-sized diamond particles through 110 μm, 230 μm to 550 μm as reinforcement, the diamond/copper-boron alloy composites were prepared via gas pressure infiltration technology under 1100 ℃ and 10 MPa gas pressure. The influences of the size of d...

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Bibliografiset tiedot

Päätekijät:	Xi WANG, Aolong KANG, Zengkai JIAO, Huiyuan KANG, Chengyuan WU, Kechao ZHOU, Li MA, Zejun DENG, Yijia WANG, Zhiming YU, Qiuping WEI
Aineistotyyppi:	Artigo
Kieli:	Chinês
Julkaistu:	Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. 2024-04-01
Sarja:	Jin'gangshi yu moliao moju gongcheng
Aiheet:	thermal conductivity diamond particle gas pressure infiltration method thermal expansion coefficient diamond/copper-boron composite material
Linkit:	http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2023.0062
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