Thermal Deformation Behavior and Interface Microstructure Analysis of 2205/Q345 Hot Compression Composite
The high-temperature thermal deformation behavior of a 2205/Q345 specimen at 850–1100 °C and strain rate of 0.01–10 s<sup>−1</sup> was systematically studied by the Gleeble-3800 thermal simulator, which provided a theoretical basis for the optimization of a 2205 duplex stainless steel composite plat...
में बचाया:
| मुख्य लेखकों: | , , , , |
|---|---|
| स्वरूप: | Artigo |
| भाषा: | Inglês |
| प्रकाशित: |
MDPI AG
2022-02-01
|
| श्रृंखला: | Crystals |
| विषय: | |
| ऑनलाइन पहुंच: | https://www.mdpi.com/2073-4352/12/2/301 |
| टैग: |
कोई टैग नहीं, इस रिकॉर्ड को टैग करने वाले पहले व्यक्ति बनें!
|