Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching

Selective laser etching is a promising candidate for the mass production of glass interposers. It comprises two steps: local modification by an ultrashort-pulsed laser and chemical etching of the modified volume. According to previous studies, when an ultrashort-pulsed laser beam is irradiated on th...

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Principais autores:	Jonghyeok Kim, Sungil Kim, Byungjoo Kim, Jiyeon Choi, Sanghoon Ahn
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2023-09-01
Colecção:	Micromachines
Assuntos:	selective laser-induced etching burst-mode laser spatial light modulator Bessel beam ultrashort pulsed laser
Acesso em linha:	https://www.mdpi.com/2072-666X/14/9/1766
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