Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials
A rigorous full-wave analysis of high Tc superconducting rectangular microstrip patch over ground plane with rectangular aperture in the case where the patch is printed on a uniaxially anisotropic substrate material is presented. The dyadic Green’s functions of the considered structure are efficient...
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| Principais autores: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Wiley
2013-01-01
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| coleção: | International Journal of Antennas and Propagation |
| Acesso em linha: | http://dx.doi.org/10.1155/2013/169893 |
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