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Analysis of High Tc Superconducting Rectangular Microstrip Patches over Ground Planes with Rectangular Apertures in Substrates Containing Anisotropic Materials

A rigorous full-wave analysis of high Tc superconducting rectangular microstrip patch over ground plane with rectangular aperture in the case where the patch is printed on a uniaxially anisotropic substrate material is presented. The dyadic Green’s functions of the considered structure are efficient...

Бүрэн тодорхойлолт

-д хадгалсан:
Номзүйн дэлгэрэнгүй
Үндсэн зохиолчид: Abderraouf Messai, Siham Benkouda, Mounir Amir, Sami Bedra, Tarek Fortaki
Формат: Artigo
Хэл сонгох:Inglês
Хэвлэсэн: Wiley 2013-01-01
Цуврал:International Journal of Antennas and Propagation
Онлайн хандалт:http://dx.doi.org/10.1155/2013/169893
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