A Study on Electrical Reliability Criterion on Through Silicon Via Packaging

Por Lwo, Ben-Je, Tseng, Kuo-Hao, Tseng, Kun-Fu
Publicado no J Electron Packag (2016)

Multi-dimensional Studies of Synthetic Genetic Promoters Enabled by Microfluidic Impact Printing

Por Fan, Jinzhen, Villarreal, Fernando, Weyers, Brent, Ding, Yunfeng, Tseng, Kuo Hao, Li, Jiannan, Li, Baoqing, Tan, Cheemeng, Pan, Tingrui
Publicado no Lab Chip (2017)