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Turbulent mixed flow applying CFD in electronic cooling
The commercial application CFX® v. 10.0 was used to assess the thermal parameters of electronic devices in which several speed values were explored in a model with a turbulent mixed forced cooling flow. The finite-volume method was used to solve the problem equations throughout the physical domain w...
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Publicado no: | Exacta |
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Main Authors: | , , , , |
Formato: | Artigo |
Idioma: | Inglês |
Publicado em: |
Universidade Nove de Julho
2011
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Assuntos: | |
Acesso em linha: | https://www.redalyc.org/articulo.oa?id=81021138011 |
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