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Characterization of Thin Films Deposited by Physical Vapor Deposition (PVD), Using Electrochemical Impedance Spectroscopy (EIS) Technique
In this paper the performance against corrosion of a thin film of NiCu deposited by Physical Vapor Deposition at two different times of deposition, was evaluated. Electrochemical Impedance results in NaCl solution, showed a gradual increase in resistivity due to the degradation of the film (delamina...
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| Publicat a: | Journal of the Mexican Chemical Society |
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| Autors principals: | , , , , , |
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Sociedad Química de México
2015
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| Matèries: | |
| Accés en línia: | https://www.redalyc.org/articulo.oa?id=47545630009 |
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