Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

[Image: see text] Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones...

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Veröffentlicht in:ACS Omega
Hauptverfasser: Wang, Ying, Tang, Bo, Gao, Yuan, Wu, Xinfeng, Chen, Jin, Shan, Liming, Sun, Kai, Zhao, Yuantao, Yang, Ke, Yu, Jinhong, Li, Wenge
Format: Artigo
Sprache:Inglês
Veröffentlicht: American Chemical Society 2021
Online Zugang:https://ncbi.nlm.nih.gov/pmc/articles/PMC8320143/
https://ncbi.nlm.nih.gov/pubmed/34337262
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsomega.1c02694
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