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Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method
[Image: see text] Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones...
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| Publicado en: | ACS Omega |
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| Autores principales: | , , , , , , , , , , |
| Formato: | Artigo |
| Lenguaje: | Inglês |
| Publicado: |
American Chemical Society
2021
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| Acceso en línea: | https://ncbi.nlm.nih.gov/pmc/articles/PMC8320143/ https://ncbi.nlm.nih.gov/pubmed/34337262 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1021/acsomega.1c02694 |
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