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Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors †
Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to...
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| Publicado no: | Sensors (Basel) |
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| Main Authors: | , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2021
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC8309728/ https://ncbi.nlm.nih.gov/pubmed/34300659 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s21144919 |
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